Dip package dimensions. For example, DIP-8 chips have two rows of four pins.

Dip package dimensions HK 0. Gull-wing leads: 1. Board Assembly Recommendations (Gullwing) Share 05_00 | Nov 12, 2020 | PDF | 2. A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. DIP (DUAL IN-LINE PACKAGE) SOCKET Quick Reference Guide TE Connectivity’s (TE) DIP socket provides a separable electrical and mechanical connection between an electronic component and a printed circuit board (PCB). A 14-pin Dual Inline Package (DIP) is a type of IC package with 14 metal pins arranged in two parallel rows. RM series features inductor transformer. The choice of package type for a given component depends on factors such as the size and complexity of the component, the requirements for its placement on the circuit Oct 29, 2024 · Common IC Package Types Dual-In-Line Package (DIP) The DIP package consists of two rows of pins parallel to one another and thus are quite manageable and suitable for through-hole mounting. Any OEM/ ODM requirement is welcome. Feb 25, 2016 | PDF | 155 kb. Body Length (mm) 22. Feb 25, 2016 | PDF | 136 kb. 1mm: 03015MM 0. 4, and AXIAL- 0. Support Follow us It represents an advancement over the conventional DIP chip package, is a widely used packaging style for integrated circuits. Package. Uncover its advantages, including cost-effectiveness and ease of use, as we delve into its impact on modern technology. 55. 6 mm; Common temperature operating range of -40°C to 85°C; Feature a compact size and ease of soldering onto a board ; The size allows for high component density, resulting in more miniaturized circuits Jul 18, 2022 · For that reason, you need to know about SMD resistor package details Size, Dimension, All you know about the future of SMD resistors in the electronics field. Surface-mount equivalent of the classic through-hole DIP (Dual-Inline Package) 1. 【Resistor Sizes and Packages】 DIPResistors DIP Resistorspackage is in the form of AXIAL-xx. 16mm_LongPads10-lead though-hole mou KiCad Libraries Symbols Footprints 3D Models Package type Properties Application; SOIC: 1. 25) 0. description: 24-pin, dual inline plastic, dip package code: p (p24) document control #:pd-2139 revision: --notes: 1. 54 mm (0. The xx behind AXIAL means the pad center spacing is xx inches. 255 (6. 6 x 0. com Rev. Letters added to it specify the package material, which is important during the assembly of circuit board and handling of the parts. This means that the imperial code 0603 has a length of 0. stp)： 3D model Data in STEP Format A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC. 77 ) Document Number: 81787 For technical questions, contact: optocoupler. 6 inches (15. Dec 14, 2015 · PDIP = Plastic Dual-In-line Package. This size is actually slightly larger than the resistor itself. all Vishay Semiconductors optocouplers are lead (Pb)-free. The overall dimensions of a DIP package depend on its pin count, which may be anywhere from four to 64. 1, 10-Dec-03 Vishay Semiconductors www. 08 Feb 25, 2016 · Package. 78 mm length. The SPDIP comes in several body widths, i. Passive Components - Small Flat Chips - Size (Footprint) Metric Code L x W: 0201MM 0. They are surface-mount IC packages that reduce the traditional DIP package to a smaller size. 62mm (0. 97 J 0. 54 typ. The footprint gives information regarding the size of the pads, the pad numbering (pin numbering), the distance between the pads (pitch), the distance between the pads along the width of the component, the outline of the component on the silkscreen, the place-bound of the component within which another component cannot be mounted, component The sizes are usually 3x3mm, 5x5mm, 7x7mm, etc. 0. 60 e2 8. Package dimensions as small as 0. 40-Pin DIP: A larger DIP package typically used for microcontrollers, memory ICs, and other integrated circuits with higher pin counts. 6. 92) 0. What is the standard name of this package type? Feb 25, 2016 · Package. 35 C 3. 55 1. 01_00 | Jul 25, 2018 | PDF Der englische Begriff Dual in-line package (Akronym DIP, auch Dual In-Line, kurz DIL, dt. PG-DIP-28-802_Package Outline_02 Share. 3" wide 16-pin (DIP16N) footprint Package: DIP8: Pin: 8: Dimensions (mm) 6. Lead SOIC vs. This is specified on "Package Information" of the datasheets, where there is always 8L (or 10L) uMAX/uSOP specification present. 71 4. The number of pins in a DIP package is always even. 733: Body Width (mm) 7. 95: Pitch (mm) 2. Thin shrink small outline package 2. 265 (6. 86 e 6. This is a 40-pin dual in-line package (DIP) socket in a turned pin format. 31 a1 0. 35: Min. It supports SOP (Small Outline Package) is a SMD component package. 1 inch spacings with a row spacing of 0. 54: Solder Ball (mm) Plating: Sn2Bi: Product Mass (mg) 510: Moisture Sensitivity controlling dimensions are in inches; millimeter dimensions (in parentheses) are rounded-off inch equivalents for reference only and are not appropriate for use in design. and pin count: Nominal body size (L3W3H) (mm) We offer customers a broad integrated circuit (IC) packaging portfolio enabled by years of engineering innovation and expertise. 57 b1 1. The Motorola 68000 (sometimes shortened to Motorola 68k or m68k and usually pronounced "sixty-eight-thousand") [2] [3] is a 16/32-bit complex instruction set computer (CISC) microprocessor, introduced in 1979 by Motorola Semiconductor Products Sector. 1, 09-Dec-03 Vishay Semiconductors www. Furthermore, SOIC packages feature exposed solder pads, which aid in enhancing heat dissipation, thereby increasing operational safety margins. Nov 8, 2018 · These marketing points would probably have driven the lead spacing and the size requirements, as well as overall package size. 20 6. The number after DIP indicates the number of pins in the package. 01_00 | Jul 22, 2019 | PDF | 212 kb Jun 23, 2017 · First, notice that the two packages are very different in layout. Small outline integrated circuit 2. Jul 23, 2020 · \$\begingroup\$ NTK Ceramics builds DIP packages for integrators of custom silicon. I know the dimensions of the part (standard PDIP20), but I can't find a single source outlining suggested distances between the holes/pads on the PCB, hole size, pad size, etc. 78 mm. 5mm, 0. 10 3. , and the number of pins generally ranges from 8 to 48. In general, DIP products are also distinguished by the row spacing, i. stp)： 3D model Data in STEP Format Jan 21, 2015 · Pin numbering is the same as a DIP package, in that pin 1 is at the top left, and then pins are numbered sequentially down the left-hand side, then up the right hand-side. 4 x 0. DIP , PDIP , SDIP daisy chain dummy components for machine evaluation, solder training and rework practice. The pin pitch of DIP is typically 2. 54mm, some specially designed DIP packages may have smaller pin spacing, such as 1. 36 0. doc Author: garytu Created Date: 5/24/2013 5:36:04 PM. 60: 15. 3 inches) pitch, and the number of pins ranges from 8 to hundreds. Full Lead Packages Fig2. The pin DIP has a rectangular housing with two parallel rows of pins that can be through-hole mounted on a breadboard, PCB, or a socket. refer jedec ms-001d/bb pkg. 95) 0. 27 bsc c 0. 1 inches) Surface Mount Resistor Packaging www. It comes in QFN20 3x3 package size but the pad layout is different to what I expected and so doesn't fit the DIP adapters I have. 3mm 4 Advanced Linear Devices Package Drawings Ceramic Packages 8-20 Pin CerDIP DA - 8 Pin Ceramic Dip Package DB - 14 Pin Ceramic Dip Package DC - 16 Pin Ceramic Dip Package DD - 18 Pin Ceramic Dip Package DE - 20 Pin Ceramic Dip Package E E1 C e1 ø D s e b1 b L A L2 A1 L1 A A1 b b1 C D-8 D-14 D-16 D-18 D-20 E E1 e e1 L L1 L2 S Ø 3. They have two parallel rows of pins that easily plug into a socket-type connector on a PCB. Controlling dimension is in inches. 54 mm) used in the imperial system. 20) High frequency transformer is available in SMD and DIP package. 060″ and a width of 0. 3" wide 14-pin plastic DIP packages (DIP14N), also known as PDIP (Plastic DIP) EPROM ICs in 0. Moreover, these pins have different pitches depending on the types of boards they are inserted into, and these may vary between 0. Plastic integrated circuit (IC) package 4. 36 d 29. Technical specifications and package dimensions: Package dimensions: 6 mm x 4 mm to 64 mm x 14 mm. The 14-pin dual in-line package (DIP) socket, also known as DIP14 socket, is an extremely useful socket used in the field of digital electronics because many 74 series logic integrated circuits (IC) are in a 14-pin outline. 779 (19. The base is covered by the cap and then sealed with molten seal glass. 92 e 2. The suffix ‘LW’ indicates an 18-lead wide-body SOIC package for surface mounting. Common variations include Dual Inline Package-16, Dual Inline Package-28, and Dual Inline Package-40, among others. The CerDIP package is composed of an upper part called the cap, and a lower part called the base. 62: Min. 100 inch intervals from each other for standard circuit board layout compatibility. 779: Body Width (mm) 7. 27 0. com Vishay Revision: 03-Nov-2022 1 Document Number: 31543 For technical questions, contact: ff2aresistors@vishay. 3 x 0. VISHAY DIP-6 Document Number 83253 Rev. 03 mb Feb 1, 2023 · DIP applications include standard logic ICs, memory LSIs, and microcomputer circuits. Click now to explore the world of PDIP and unlock new possibilities for your projects! PG-DIP-32-800 | PDIP-32 (002-16908) Overview. On the other hand, SOIC packages are smaller and intended for surface mounting. 97 I'm trying to use the capacitative touch chip CPT112S for a project. DIP Package • Ceramic covered with molding • Terminates to pins connected to ceramic •Model Higher power rating than chip array HOW TO ORDER - THICK FILM CHIP ARRAYS CA T 10 A - 103 4 L Chip Arrays Type • T Concave • Y Convex Package Size • 06 0202 • 10 04 • 16 06 • 1 1206 • 25 1608 Feature A AEC-200 Compliant Title: Package Drawing - PDIP 28-Lead (Wide . 1 inches (2. 8, AXIAL-0. 8: Thickness (mm) 3. However, prior to the emergence of surface mount technology, the Dual In-line Package (DIP) was the most widely used package using the through-hole mounting technique from the 1960s up to the early 1990s. and Dimensions 2 A5581-02 Plastic Dual In-Line Package, Shrink Dip Unpackaged Devices 8 0 3 8 6 S X 1 6 S X 3 8 7 Up to15 Alphanumeric Characters For Device Types Sep 14, 2024 · Depending on the DIP package size and composition, there are a set of variants, which are used on different types of applications. 00 mm 7. The pins of a DIP IC are spaced 2. Package Dimensions The suffix ‘A’ indicates an 18-lead plastic DIP package with a copper lead frame for better heat dissipation. High Reliability: QFN packages achieve stable electrical and mechanical connections through pad connections, providing reliable packaging and protection. , e 1 between the two rows of leads, in DIP300mil, DIP400mil, DIP600mil, DIP750mil, and DIP900mil series as in Fig. Structure of Dual Inline Package The engineer, technician, or hobbyist using small numbers of gates will likely find what he or she needs enclosed in a DIP (Dual Inline Package) housing. MDIP = Molded Dual-In-Line Package. stp)： 3D model Data in STEP Format Body Length (mm) 30. stp)： 3D model Data in STEP Format description: 14-pin, dual inline plastic, dip package code: p (p14) document control #:pd-2135 revision: --notes: 1. 7, AXIAL-0. 3 inches) Pin Pitch: 2. They are smaller in external size than standard DIPs and VISHAY DIP-6 Opt. 018 0. 16 mm (400 mils) DIP-10_W10. 95 x 0. e. 32 7. 40 9. 36 d 18. PG-DIP-7 Jun 23, 2011 · μMAX packages (Maxim uses 8-pin and 10-pin versions of this package) seems (by PCB footprint at least) the same as μSOP aka MSOP aka micro-SOP packages. For detailed PCB layout drawings click here to go to the Semiconductor Vendor Links page on RF Cafe. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. 20 0. 5, AXIAL-0. Saturday , March 22 2025 Despite its longevity, DIP faces challenges such as its larger physical size and manual assembly requirements, which can impact production scalability and cost. The other is a surface-mount package which does not use rows of pins. See full list on electronicsforu. Aug 8, 2023 · Common IC Package Types. 2 x 0. 52 bsc c 0. It is mainly designed to improve production efficiency and heat dissipation. 38 0. It provides insights into the utilization and assembly process of DIP components in Jan 14, 2015 · DIP28S could be a "shrink DIP" through-hole package, that is basically a standard DIP x 0. stp)： 3D model Data in STEP Format Tube Dimensions (mm) Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. 20 3. The difference between Plastic and Molded is completely irrelevant for you ! Just get the cheapest. As the lead count increases, the package size increases sharply thereby reducing the space efficiency. The dimensions are usually 50. Dual In-Line Package (DIP) Dual In-Line Packages are one of the earliest and most common IC package types. 62 mm (0. This section discusses how innovations in automated DIP assembly techniques and new materials are addressing these challenges. 00 mm width 4. The PDIP is robust and resistant to moisture, but it is also much bulkier than its modern successors. DIP packages come in various pin counts, such as 8, 14, 16, 20, and more. Common packages include AXIAL-0. 25 29. The base has a cavity where the microchip is mounted. PG-DIP-23-2_Package Outline Share. 25: Body Width (mm) 6. Subject: Outline Dimensions Keywords: 8-Lead Plastic Dual-in-Line Package [PDIP] Created Date: 2/14/2003 4:16:14 PM The PDIP comes in two body widths, i. Package Dimensions Cybernetic Micro Systems 40-Pin DIP Dimensions. 00 a l b1 e b a2 a1 e2 e1 c d May 21, 2013 · Title: Microsoft Word - DPC-0000011_EL817-G Series Datasheet rev7. 01_00 | Aug 11, 2022 | PDF | 102 kb. 06_00 | Jul 20, 2022 | PDF | 117 kb. The DIP is a commodity through-hole package with up to 84 pins and a most common lead pitch of 2. For DIP packages with a standard pin pitch of 0. 7 Document Number 83264 Rev. 014 (0. inductance, resistance and impedance). Legacy systems and replacements for older components. \$\endgroup\$ – Tube Dimensions (mm) Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. 115 (2. 62 mm (300 mil) and with 20 or more pins. corner leads may be configured as whole or half leads. . Live with it. Dec 3, 2021 · Hi I would like to make a footprint for a DIP20 package, but I cannot find any information regarding the recommended distances between pads. 600 Inch) 05-08-1520 Author: Linear Technology Corporation Keywords: Packaging Created Date: 7/25/2005 3:48:51 PM Jan 16, 2024 · The number of pins also determines the size of the DIP package. For example, a through-hole IC package with two rows of eight pins would be a DIP16. 48). com These through-hole (PTH) packages include: DIP (Dual In-line Package) The venerable DIP, introduced in 1964, has two parallel rows of through-hole pins projecting from the long edges of a narrow rectangular plastic or ceramic body. The silicon circuit inside is IDENTICAL (assuming they are from the same manufacturer). QFP packages share similarities with SOIC but offer a higher pin density, making them suitable for higher-performance circuits. This package type is found most commonly in prototypes or basic PCB designs because placing is quite easy. Lead pitch: 2. Source: TopLine Corp. 60 e1 7. 01_00 | Mar 02, 2024 | PDF | 102 kb There is an optocoupler which comes in DIP package. Jun 08, 2011 | EPS | 277 kb Feb 22, 2023 · There are many other SMD package types as well, including the Chip Scale Package (CSP), the Micro Leadframe Package (MLP), and the Quad Flat No-lead (QFN) package, among others. I never used DIL. 54 mm (1. Also "DIP28S" has also been used to refer to the "skinny" 300-mil wide 28-pin DIP package to distinguish it from the 600-mil wide package. ) inside the package. lead DIP package TT Electronics. The distance between two rows of pins (row spacing, row spacing) depends on the number of pins, the most common is 0. For example, DIP-8 chips have two rows of four pins. 1" (2. Common variations: DIP – Dual In-line Package, 2+ pins; CDIP – Ceramic DIP, widespread until the 1990s Feb 15, 2024 · This is the most widely available package for crystal oscillators. Here are some common electronic component package sizes along with their dimensions: Through-Hole Packages: DIP (Dual Inline Package): Width: 7. 0. 20 mm 7. 1 g Printed on moisture barrier bag Oct 27, 2017 · Part Selection: DIP4 package: Vishay’s VO617A series optocoupler DIP8 package: Some TI’s OPA series op-amps DIP14 package: LM339N comparators DIP28 package: ICM7218 LED drivers DIP IC Sockets: TE Connectivity’s 1-2199 series . 008 (. Discover the power of PDIP Package, a versatile and lightweight IC package type that revolutionizes electronic designs. 52mm and 10. This package type has a relatively lesser cost Mar 12, 2022 · designers a choice of nine small outline packages and 12 gullwing Smd diP packages. They are smaller in external size than standard DIPs and Skinny Dual In-line Package Skinny DIP packages are standard DIPs with spacing between terminal rows of 7. , 300 mils and 600 mils. SOIC Packages SOICs or Small Outline Integrated Circuit packages are surface-mount equivalents of DIP Nov 28, 2023 · According to the different package materials, DIP products can be divided into ceramic DIP package (CDIP) and plastic DIP package (PDIP). 1 Mar 23, 2025 · The provided article discusses the concept of DIP (Dual In-line Package) IC chip packaging in the context of integrated circuits. Since both are DIP (Dual-In-line Package) you can use them on a breadboard. 54mm), which is a standard spacing and perfect for fitting into breadboards and other prototyping boards. II. If this doesn't seem to be the case, please link to the specific datasheets and products you are discussing. 40 1. The number of pins determines the overall size of the DIP package. The micro SOIC package is another style of SOIC package, designed only for 8-pin or 10-pin ICs. TI and Analog Devices obtain and/or build DIP packages for their own chips, and as such, the die size is not a datasheet parameter. TO-263 is a variant of TO-220. DIP-enclosed integrated circuits are available with even numbers of pins, located at 0. description: 16-pin, dual inline plastic, dip package code: p (p16) document control #:pd-2136 revision: --notes: 1. Shrink Dual In-line Package Shrink DIP packages are standard DIPs with a lead pitch reduced to 1. 3, AXIAL-0. RoHS Pb-Free or SnPb THROUGH HOLE TECHNOLOGY, THT, THT PACKAGES . stp)： 3D model Data in STEP Format The DIP is extremely popular due to its reliability and ease of use. 54 bsc l 3. 50 D 0. Prototype and hobbyist projects. com DIP-16 Document Number 83239 Rev. 3D Interactive PDF Model PG-DIP-23-900 Share. 2mm: 0603MM 0. 01_00 | Jul 25, 2018 | PDF | 9 kb. 78 mm, but are less common. I was expecting a package like this with pads along the edges and not in the corners: Apr 13, 2023 · The wide body SOIC package (sometimes referred to as SOx_W or SOICx_W) is a larger version of the narrow body SOIC package, with differences mainly concentrated on the dimensions of WB and WL. There has been a growing trend for small package sizes of most components. 1, 10-Oct-07 5 Packages Packages Vishay Semiconductors DIP-4 OPTION 9, PACKAGE DIMENSIONS in inches (millimeters) Here are the primary package and pin spacing dimensions for some of the most common DIP (Dual Inline Packages). Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. Lead counts range from 8 to 64. In no way is it the same as an SOP-28 SMT package. Jun 20, 2024 · 5. When terminal width is narrow, allowable tolerance is increased by the difference with the maximum width. This has resulted 16-Lead Plastic Dual In-Line Package [PDIP] Narrow Body (N-16) Dimensions shown in inches COMPLIANT TO JEDEC STANDARDS MS-001-BB 0. Jun 9, 2023 · DIP package CPU chips have two rows of pins, which need to be inserted into the chip socket with DIP structure. 30) 0. DIP. The typical dimensions are 10. Our package options range from traditional leaded and leadless packages (small outline package (SOP), quad flat package (QFP) and quad flat no-lead (QFN)) to advanced ball grid arrays using wire bond and flip-chip interconnects and wafer-level packages. It explains how DIP packaging works, its features, pros and cons, and various types of DIP packages. 02 9. 56 F 1. 54 mm, and the contact material is usually phosphor bronze. DIP is available in plastic (PDIP) or ceramic body (CDIP), and is convenient for prototyping and breadboard applications through soldering or socketing. 58 mm 4. Tube Dimensions (mm) Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. 97 x 52. Using the maximum material principle, show the tolerance for maximum terminal width. Analog Jun 8, 2011 · Pieces/Tube: 2000: Tubes/Box: 40: Downloads. A width of 17. It used to be quite popular in the Asian market (eg. 54mm (100mil). May 5, 2024 · Electronic Component Package Sizes. The package itself also cannot support fast logic transitions that are required in modern computing protocols. 6. Our large selection of DIP and HOLTITE sockets ranging from 1 to 48 contacts provides a highly reliable connection between your integrated circuit (IC) devices and PCBs. Body Length (mm) 9. Package Dimensions Dec 6, 2023 · DIP packages, characterized by their larger size and low-density design, are primarily used for through-hole mounting. DIP IC was replaced by SOIC by removing pins that were inserted into holes in the board. 300” Wide) Ceramic Dual-in-Line Package, EPROM NS Package Number J24CQ Ceramic Dual-in-Line Package (Cerdip) www. 80 19. 71 0. In microelectronics, a dual in-line package (DIP), sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins. Title: N-8 Author: Analog Devices, Inc. 195 (4. Like you understood DIP is a family. refer jedec ms-001d/aa pkg. 115 0. Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material; SOT129-1: DIP40: through-hole mount: double: DIP: 40: plastic Pieces/Tube: 2000: Tubes/Box: 40: Downloads. 27 mm are less common). 3D Interactive PDF Model PG-DIP-14-903 Share. It is proportional to the current value. C-DIP-28-800_Package Outline Share. 4000-series logic ICs in 0. 54 mm), the width is typically determined by the number of pins and the spacing between the two rows of pins. Most manufacturers use the JEDEC standards to ensure that surface mount resistors are all the same size and shape. 022 0. 1. Terminal Pitch (mm) Diagrams. DIP (Dual Inline Package) The common size is 7. I'm prototyping and so need to be able to hand-solder the chips. 0 mm, Jan 8, 2024 · SMD Resistor Sizes. Distance between the center of terminal located at the extreme edge and the package edge. com 1 DIP-16 Package Dimensions in Inches (mm). TO-220 packages Footprint Description DIP-10_W10. 24 mm). 36) 0. As the lead count increases, the internal lead traces also increase. The pin spacing (pitch) is 2. 20 e 6. Jun 18, 2019 · Surface mount technology, SMT components come in a variety of packages. They are generally available in the same pin-outs as their counterpart DIP ICs. This type of package is often used for basic logic chips, operational amplifiers, and other ICs that do not need many connections but still perform useful tasks. This will increase the electrical characteristics of the package (i. lead DIP package KTLP250S: 213Kb / 8P: This unit is 8. DIP (Double In-line package) A Dual-in-line package (DIP or DIL), or dual-in-line pin package (DIPP) is an electronic component package rows of electrical connecting pins. DIP package chips should be inserted and removed from the chip socket with special care to avoid damage to the pins. 07 x 5. 6, AXIAL-0. lead DIP package KTLP350H: 191Kb / 8P: This unit is 8. We look forward to Dec 13, 2022 · The overall size of a DIP package depends on its pin count. A number code, like 0603, tells you what size SMD resistor it is. One is called a DIP (Dual Inline Package - and yes, DIP package is redundant. . PG-DIP-8-13_PDF Share. DIP is usually appended with a number indicating how many pins the IC has. The length and width of the package are in this code. Yuan Dean can provide high-frequency transformers of various specifications, and all are RoHS-compliant, and can be customized according to customer requirements. «zweireihiges Gehäuse») ist eine längliche Gehäuseform (engl. 01_00 | Jul 13, 2018 | PDF | 7 kb This unit is 8. answers@vishay. If you are curious about any specific package technology then go ask the manufacturer. Apr 11, 2024 · Common applications for DIP packages: Through-hole PCB assemblies. DIP means dual inline package, was used mainly for thru hole components. Use of DIP sockets also can minimize the risk of Package Outline Dimensions PDIP-8 PDIP-8 Dim Min Max A 9. 130 (3. Plastic DIP/SKDIP Outline Dimensions Fig1. Electronic components come in various package sizes, each designed for specific applications and requirements. 54SOP4 1. Plug-in Packaging (THT) - Through hole technology component packages. 3D model(. 54mm apart, which is a standard spacing, perfect for inserting breadboards, veroboards, and other prototyping boards. 81). 00 a l e b1 b a2 a1 c e2 e1 d Microchip Technology Mar 29, 2023 · DIP packages used in the former Soviet Union and Eastern Europe are similar to JEDEC standards, but the pitch is 2. Some packages with widths of 7. DIP (Dual Inline Package) SOIC (Small Outline Integrated Circuit) PLCC Small Package Dimensions : Package designation. In microelectronics, a dual in-line package (DIP or DIL) [1] is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. , 300 mils, 400 mils, 600 mils and 750 mils. com www. Most SPDIP IC's have lead counts that range from 28 to 64. com 6 Tube Dimensions (mm) Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. 070 Dimensions. 11-5H1S: Toshiba’s package code for it’s 2. Package Compliance Report Share. 54 mm). 60 b 0. ) package, and the pins (not the plastic body) are spaced on 0. These devices can handle 120 mA continuously for each output at an ambient temperature of +50°C and a supply of 15 V. 78 and 1. DIP derives a higher density package form – SDIP (Shrink DIP), which has six times the pin density of standard DIP. The common number of DIP package pins is 4, 6, 8, 10, 12, 14, 16, etc. 16mm10-lead though-hole mounted DIP package, row spacing 10. The key distinction between DIP and SPDIP lies in their size. This is because of package parasitics (pin-package and lead capacitance), which limit the available channel bandwidth and greatly slow down signal transitions. national. Common packages range from 3 to 64 or even 100. 00 3. Package Outline Share. Terminal Pitch (mm) PG-DIP-7-10_Package Outline Share. 015 0. The PDIP is a through-hole package, which means that its leads protrude to the other side of the circuit board once mounted. Ceramic DIPs are frequently used for testing MEMS Mar 1, 2024 · Dual in-line package (DIP) TO-252/D-PAK package size specifications. 3 inches (7. dimensions(mm) symbol min max a 3. There a several common sizes that are used and this enables the manufacturing pick and place machines to be set up to accommodate these sizes. 85 mm 2. DIP89POE Share. May 17, 2023 · Are there different sizes or variations of DIP packages? Yes, DIP packages come in various sizes and pin configurations. refer jedec ms-001d/be pkg. Standard package for logic IC: TSSOP: 1. 008 (0. SPDIP packages have reduced physical dimensions, enabling greater component density on circuit boards and efficient space utilization. Size: SOIC packages are significantly smaller than DIP packages, offering higher component density and space Sample footprints of a transistor, IC and SON-6. Most common ICs offer a DIP package option. Low-frequency analog and digital circuits. 54mm, etc. 67 mm × 17. This SMD package is not SOIC, because its pin pitch size is 100mil instead of 50mil. 16 mm width, and 17. vishay. 030″. YAGEO provides SMD (case size: 0603 ~ 2920) and DIP package types for the usage in different applications. Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material; SOT129-4: DIP40: through-hole mount: double: DIP: 13. Package Outline Dimensions PG-DIP-23-900 Share. Each of the pins on a DIP IC are spaced by 0. 01_00 | Jul 23, 2018 | PDF | 221 kb Jun 30, 2021 · IC packages types are mainly divided into traditional DIP dual-in-line and SMD chip package. The most common pin counts are four, six, eight, fourteen, eighteen, twenty, twenty-eight, and forty pins. OPIA800: 1Mb / 20P: DIP Package OPIA814: 1Mb / 17P: DIP Package Galaxy Semi-Conductor H DO-213AB: 23Kb / 1P: Package Dimensions SOD-123FL: 21Kb / 1P: Package Dimensions Our Dual Inline Package (DIP) sockets with positions ranging from 1 to 48, make it easy to get a highly reliable connection between your IC devices and PCBs. 15 6. stp)： 3D model Data in STEP Format Skinny Dual In-line Package Skinny DIP packages are standard DIPs with spacing between terminal rows of 7. 9, AXIAL-1. Pin count: 8 to 64 pins. sop-4, sop-8, and sop-16 (half-pitch miniflat) : With a profile of only 2. 51 a2 3. Jul 8, 2024 · Although DIP packages come in a range of shapes and sizes, most adhere to standard dimensions and specifications established by the Joint Electron Device Engineering Council (JEDEC): Pin spacing : 0. 4x8. 60 mm Features, Applications: All dimensions and tolerances conform to ANSI ­ 1994. The number stands for lead count. 28-Pin DIP: This size of DIP package is commonly used for microcontrollers, memory ICs, programmable logic devices (PLDs), and other integrated circuits requiring a moderate number of pins. 5 millimeters, which is based on the metric system, rather than 0. Are DIP packages still commonly used today? May 29, 2023 · Compact Size: With the leadless design, QFN packages have smaller dimensions compared to traditional leaded packages, facilitating compact circuit board layouts and high-density integration. Rectangular surface mount 3. 20) 071006-a Dual in line packages: DIPs come in either plastic or ceramic versions and have two rows of interconnects along two opposite sides of the package. The package may be through-hole mounted to a printed circuit board (PCB). The article also touches on the comparison between DIP and other packaging types. 7. 099: Body Width (mm) 7. 00 a l e b b1 d e e2 e1 c a2 Each of the pins on a DIP IC are spaced by 0. Polarity Marks There are three ways of indicating the polarity on a SOIC package. 020 (. 130 0. Nov 2, 2023 · Compared to Dual In-Line Package (DIP), Small Outline Integrated Circuit Packages are more compact. Sym: Description: Inches: mm A : Overall Width: 0. In general It has very low resistance under normal working status, no impact on the working circuit. 07_00 | Jun 21, 2022 | PDF | 105 kb. 65 G 2. 010 (0. 1/2 Lead Packages ˜ ˚ ˛ ˝ ˙ ˆ ˇ ˘ ˜ ˚ ˛ ˝ ˙ ˆ ˘ 300mil DIP Package Pin Parameter Mar 12, 2022 · Vishay Semiconductors Opto - DIP-4, LSOP-4, SOP-4 and SSOP-4 Phototransistors pAckAge compArison pacKaGe coMparison Length 10. 53 B 6. 10 mm 3. Package Outline Dimensions PG-DIP-6-903 Share. com 1 DIP-6 Package Dimensions in Inches (mm) i178014. 6" wide ceramic DIP40W, DIP32W, DIP28W, DIP24W packages, also known as CDIP (Ceramic DIP) Eight-contact DIP switch with 0. 16mm are called skinny DIP and slim DIP (narrow-body DIP). N is the number of leads. 54mm) Package Dimensions. The DIP package is connected to external circuits through pins on both sides. Package ) für elektronische Bauelemente , bei der sich zwei Reihen von Anschlussstiften (Pins) zur Durchsteckmontage an gegenüberliegenden Seiten des Gehäuses befinden. com 1 DIP-6 Package Dimensions in Inches (mm). There are a variety of other sizes and values to choose from. Apr 16, 2023 · Example DIP-14 package dimensions. 16 mm 10. Among the most common DIP package variants are the Plastic DIP (PDIP), Skinny DIP (SKDIP), Glass-sea ceramic DIP (CER-DIP), Dual In-line with window package (WDIP), Ceramic DIP (CDIP) and Molded DIP (MDIP). 36 K 2. DIP sockets enable easy replacement of components received by such sockets. 51) 24 Lead Ceramic Dual-in-Line Package, EPROM NS Package Number J24BQ 24 Lead (0. 15mm: 0402MM 0. Fujitsu). 62 mm) or 0. Downloads. As such, the SPDIP provides a smaller package size compared to a standard PDIP for the same lead count. The SOP is the SMD equivalent of the DIP component package, and has the same pitch of 2. The response speed of PPTC is from few dozen ms to few seconds level. 778 mm (70 mil). 92 Dual in-line packaging itself is a component packaging method, and its working principle depends on the electronic components (such as integrated circuits, diodes, etc. 150 0. The CerDIP is a hermetically sealed package that keeps out moisture and contaminants once it is sealed. Each row has seven pins, making it good for medium-complexity circuits. But it also has an SMD version of the DIP package. 65mm, 2. 24: B The commonly used DIP package conforms to the JEDEC standard, and the pitch (pitch) between the two pins is 0. DIP-16 package dimension, in inches. General Information Jul 24, 2016 · Whether the package carrier supports multilevel interconnect; Design of the package lead frame; Number of pins on the DIP package; Length to width ratio of the integrated circuit chip; So as it stands there is no way to answer your question as written. Ordering Code Reference Package Acronym Lead Material Lead Finish JEDEC Outline JEDEC Option Weight Moisture Sensitivity Level D CerDIP Alloy 42 Solder dip (60/40 typical) 4. Synonyms. The pins are all parallel, point downward, and extend past the bottom plane of the package at least enough to be throughhole mounted to a printed circuit - Jul 16, 2024 · However, DIP packages typically adhere to standardized dimensions and pin layouts to ensure compatibility and interoperability across different manufacturers and product lines. Dual in-line or dual row packages offer pin/peg or through-hole leads on two parallel sides. 78 mm indicates the wide format, which is the most used in the electronics industry. vtwzb mjkg eeeqrr zmjt kkxib mzpqcp oanwmam qie yns lidmqr rzkx oxgb ipcded fygvpcynp icz